Epoxy Resin - Epoxy Resin For Adhesive Anchor NEW-1101A/B
Performance and Application:
NEW-1101A/B is a kind of epoxy resin encapsulation material solidified at room temperature. Good weather resistance, strong toughness,good transparency.Suitable for lighting products, process products and light-emitting electronic components of the adhesive point and other electronic devices packaging.
Before use, the ingredients are compounded according to the ratio of the products. Pay attention to the accuracy of the weighing, and fully mix the prepared A/B materials.Just use it. In winter, due to the lower temperature, the material A can be preheated in an oven at 80-90 °C for 1 to 2 hours.Use to avoid bubbles in the product.
|Model||Performance||The Ratio And Curing Conditions||Properties After Cuting|
Room Temperature And Ventilation
NEW-1101A/B Weight Ratio
Packing and Transport:
A material is packed in 6kg plastic drums,B material is packed in 6kg plastic drums.
Indoor and ventilated store below 25 ℃.
The above performance data is typical data measured in a laboratory environment with a temperature of 25 ° C and a humidity of 50%.When the user uses the reference, it does not guarantee all the data that can be achieved in a specific environment. Please use the customer when using it.