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Can hot melt adhesive replace epoxy resin in production?

Sep 27, 2019

1. Application of hot melt adhesive molding in the production of epoxy resin.
Manufacturing companies looking for a cost-effective alternative to epoxy resin should consider using a low-pressure injection molding process. Compared with traditional epoxy resin, the advantages of low pressure injection molding include easy to use, elimination of curing time and environmentally friendly process. Hot melt forming is particularly suitable for the automotive and medical device industries, where connectors and switches need to be sealed and waterproof and dustproof.

1.1 increasing popularity of hot melt adhesive and low pressure injection molding.
The hot melt industry is expected to grow to nearly $10 billion by 2020. Although epoxy resins or other adhesives may provide better solutions, the use of hot melt adhesives and low pressure injection molding has grown steadily in China and around the world. The following is a summary of the main advantages of hot melt adhesive and low pressure molding process.

1.2 main advantages of hot melt adhesive.
Although there are many factors leading to the increasing popularity of hot melt adhesives, one of the main reasons for the increase in the use of hot melt adhesives is the gradual migration of solvent-based adhesives. Because of its solvent-free composition, hot melt adhesives facilitate compliance with industrial and environmental regulations. The additional advantages of hot melt molding are summarized below:
Compared with other adhesives, hot melt adhesive has a longer shelf life.
Hot melt adhesive is affordable.
Hot melt adhesive can be purchased in batches.
Hot melt forming residue can be discarded without damaging the environment.
Hot melt adhesive is easy to configure.
With these advantages, hot melt adhesive is an excellent adhesive choice for many industries. Because of its low viscosity and rapid cycle time, it is also suitable for low pressure molding.

1.3 low pressure injection molding process.
Low-pressure injection molding involves the use of hot melt adhesive to seal and protect electronic components, such as circuit boards and electronic components in automobiles. The adhesive technology is also used to mold protective washers. The low pressure molding process prevents water and dirt from interfering with the function of the protected components.

1.3.1 Application of low pressure forming in Automobile Industry.
Hot melt molding is a proven adhesive solution for the production of automotive parts. Hot melt molding of internal components is effective, including the following:
Oxygen sensor.
Sealed pressure sensor.
Control board.
Speed sensor.
Vehicle computer.
In addition, in the automotive industry, hot melt adhesive is also used in other production capacity:
Door panel bonding.
Windshield bonding.
Bonding of exterior ornaments.
Adhesion of weatherstrip and gasket.
Bonding of trunk lines.
Because hot melt adhesives can bond well with glass, hot melt adhesives are very suitable for the automotive industry. In addition, low pressure hot melt forming is an excellent choice to protect automotive electrical components. Finally, low pressure injection hot melt adhesive is beneficial to be used in assembly line environment.

1.3.2 low pressure injection Molding in Medical device Industry.
Medical devices increasingly contain components that need to be sealed and protected by environmental factors. Like cars, medical devices include oxygen sensors, control panels, and pressure sensors. These components must prevent fluids and debris, or the functionality of the device may be affected. Low pressure molding is an effective means of sealing components for the following types of medical devices:
Patient vital signs monitor.
Anesthetic machine.
Electrosurgical equipment.
Ventilator.
Incubator.
Like cars, hot melt adhesives can be used to bond external parts of medical devices. Examples include the application of plexiglass assemblies and washers in incubators. The protective shell and the screen can also be bonded with hot melt adhesive.

1.3.3 additional low pressure molding applications.
In addition to the growing popularity of automotive and medical devices, low-pressure injection molding is also emerging in other industries. Examples of manufacturing companies that benefit from low pressure molding include:
Manufacturer of USB thumb drive.
Identify label manufacturer.
Manufacturer of electronic products.
Ship manufacturer.

2. When epoxy resin is a better solution.
Although hot melt adhesive provides many advantages for users, the bonding properties of epoxy resin are impressive and can not be ignored. The high stability and resistance to harsh chemical and physical conditions of epoxy resins make epoxy resins a viable solution in many industrial environments, especially those that require adhesives used with metal products. Epoxy resin is famous for its high temperature resistance. The following are some examples of epoxy resins that will exceed the reasonable choice of other hot melt adhesives and other types of adhesives:
Development of Aerospace products.
Manufacture of products that require chemical resistance.
Construction of products that need sustainable heat resistance.
Manufacture of sterilization equipment.
Situations in which alternative welding is sought.
Obviously, the benefits of epoxy resins deserve to be considered in a variety of applications, especially those that require excellent resistance to harsh environments.

 

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