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Product Details



Viscosity Pa.s

Gel Time (mins)




Orthophthalic-NPG resin



 9171H resin thickening fast, good fluidity, excellent strength, product surface brightness, good heat resistance

Suitable for SMC/BMC application in electrical, automotive and architectural fields, such as watch box, electrical switch, insulator, sleeve, lamp, tableware tray, etc.

Directions for use:

  1. The resin contains no wax, accelerant or thixotropic agent.

  2. 9171H is usually used in conjunction with 9262 for low shrinkage molding plastics.The ratio of 9171 to   9261 is generally recommended to be 70:30, which can also be adjusted according to the actual situation.

  3. To ensure the storage of SMC/BMC materials, stabilizers should be added in production.

  4. NEWECO 9172 resin is recommended for those with higher performance requirements.

  5. Recommended formula for SMC initial paste:

      9171H  resin 70

      Low shrinkage agent 9262 30

      TBPB 1.5

      Zinc stearate  4

      Heavy calcium carbonate 150

      Light magnesium oxide 0.88

The application case:


Lamp manufacturers, products for the molding pressure lamp bowl

Customer production formula and process

9171 h resin 20 kg

PVAC type low shrinkage agent (content: 33%)     13KG

heavy calcium carbonate                                         36 kg

Light calcium carbonate                                          26KG

Zinc stearate                                                            0.6kg

Curing agent for                                                     0.4 KG

Glass fiber                                                               13.5 KG

Mold temperature                                                  180-190 ℃

The holding time is about                                      1.5min

Resin Casting Properties

PerformanceParameterUnitStandard test
AppearanceResin casting body without defects

Barcol hardness40
GB/T 3854-2005
Heat deflection temperature110GB/T 1634-2004
Elongation at break               2.5                 
%GB/T 2567-2008
Tensile Strength60MpaGB/T 2567-2008
Tensile modulus of elasticity


MpaGB/T 2567-2008
bending  strength90MPaGB/T 2567-2008
bending  modulus3100MPaGB/T 2567-2008

Executive Standard: JC/T1092-2008

Performance index of liquid resin
ProjectThe scope ofUnitTest standard
appearanceyellow tansparent thick liquid

Acid value20-26mgKOH/gGB/T 2895-2008
Viscosity, 25 ℃2.0-2.2Pa.sGB/T 7193-2008
Solid content66-71%GB/T 7193-2008
Thermal stability, 80 ℃≥24HGB/T 7193-2008
Gelation time, 25 ℃20-14minGB/T 7193-2008
ReactiveGelation time30-100sGB/T 24148.6-2009
Cure time90-150s
Exothermic peak230-270
Gel time test: take water bath at 25c and add 0.9g T-8M (Neweco,1%Co) into 50g resin. and 0.9gM-50(Akzo-Nobel)

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