(Glass transition temperature): refers to the approximate midpoint of the narrow temperature range at which the cured product changes from the glass form to the amorphous or high elastic state or fluid state (or vice versa), called the glass transition temperature, usually expressed in Tg , Is an indicator of heat resistance.
Shrinkage ration: It is defined as the percentage of the ratio of the shrinkage to the size before shrinking, and the shrinkage is the difference between the size before and after shrinking.
Internal stress: In the absence of external force, the internal stress of the colloid (material) due to defects, temperature changes, and solvent effects.
Chemical resistance: refers to the ability to resist acids, alkalis, salts, solvents and other chemical substances.
Flame resistance (Flame resistance): refers to the ability of a material to resist burning when it comes into contact with a flame or hinder continued burning when leaving the flame.
Weatherability (Weatherability): refers to the material's resistance to exposure to sunlight, heat, cold, wind and rain.
Aging: The cured colloid undergoes a series of physical or chemical changes due to external factors (heat, light, oxygen, water, radiation, mechanical force and chemical media, etc.) during processing, storage and use. Cross-linking and brittleness of polymer materials, cracking and sticky, discoloration and cracking, rough foaming, surface powdering, delamination and peeling, performance deterioration, and loss of mechanical properties can not be used, this kind of change phenomenon is called aging.
Dielectric Constant (Dielectric Constant): also known as permittivity, permittivity (Permittivity). It refers to the amount of "Electrostatic Energy" (Electrostatic Energy) that can be stored per "unit volume" of an object under each unit of "potential gradient". When the "permeability" of the colloid is larger (indicating the poorer quality), and the two approaching wires are working with current, it is more difficult to achieve the effect of complete insulation, in other words, the more likely it is to produce a certain degree of leakage. Therefore, the dielectric constant of the insulating material should be as small as possible under normal circumstances. The dielectric constant of water is 70, and very little water can cause significant changes.
4. Epoxy resin glue is mostly thermosetting glue. It has the following main characteristics: the higher the temperature, the faster the curing; the more the amount of mixing at a time, the faster the curing; and the phenomenon of heat release during the curing process.