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Epoxy Resin Modification Analysis

Jul 03, 2020

Epoxy resin modification analysis

Epoxy resins are thermosetting resins containing an average of two or more epoxy groups per molecule. Epoxy resins are widely used because they are easy to process and have excellent properties. The development of aerospace, electronics, electrical and other fields requires epoxy resins to have high performances such as heat resistance, water resistance, weather resistance, impact resistance, low stress, and adhesion. Oxygen alloying, filling inorganic fillers, expanding monomer modification and developing new curing agents have become one of the research and development goals. Phenolic epoxy resin is an important variety to develop early and mature high-functionality epoxy resin. It has a high degree of crosslinking after curing, and at the same time, due to the presence of a large number of benzene rings in the skeleton, it has a high heat deformation temperature and excellent thermal stability, both bisphenol A epoxy resin and phenolic resin advantage. The number of functional groups of DEN431, DEN438, DEN439, and DEN485 epoxy resins of American Dow Chemical Company are 2.2, 3, 6, 3.8, and 5.5, respectively. In addition, the epoxy resin synthesized by the condensation reaction of cyanuric acid and epichlorohydrin in the presence of NaOH has 3 functional groups, and the epoxy resin with a functional group number of 3-3.5 has good fluidity and long storage period, YH-434 The series of epoxy resins have 4 functional groups, which are characterized by high activity, high curing crosslink density, cured products with better toughness, good resistance, and chemical resistance. In addition to the use of multifunctional epoxy resins or crosslinking agents, the development of heat-resistant epoxy resins also uses special bifunctional resins. This bisphenol-type crystalline epoxy resin is characterized by low melt viscosity and good sealing. As a packaging material for integrated circuits, it has not been cracked by heat resistance tests. The biggest characteristic of bisphenol F type epoxy resin is low viscosity, good processability and mechanical properties, and also has good heat resistance, water resistance and electrical properties. Therefore, various manufacturers compete to develop