Epoxy resin refers to a compound that contains two or more epoxy groups in the molecular structure and can form a three-dimensional network cured product in the presence of appropriate chemical reagents. It is an important class of thermosetting resins. Epoxy resins include both epoxy-based oligomers and epoxy-containing low-molecular compounds. Epoxy resin can be divided into liquid epoxy resin and solid epoxy resin according to the state at room temperature. Let's take a closer look at it.
Liquid resin refers to a resin with a relatively low molecular weight and a low average molecular weight. The average degree of polymerization is n=0~1.8. When n=0~l, it is liquid at room temperature, such as YN1828, BE188(E-51), YN1826 (E-44), etc., can be used as castables, solvent-free adhesives and coatings.
Solid resin is an epoxy resin with a relatively high molecular weight. It is a thermoplastic solid oligomer with a relatively high average molecular weight. n=1.8~19. When n=1.8~5, it is medium molecular weight epoxy resin. The softening point is 55~95℃. Such as BE501 (E-20), BE501 (E-12), etc., can be used for powder coatings and solid molding materials.
Solvent epoxy resin is a low molecular weight epoxy resin solution. It is made by mixing solid resin and solvent in a certain ratio. For example, BE501X75, the main resin is 501 solid resin (E-20), X is the solvent (xylene).