Since the beginning of 2020, due to the impact of the global epidemic, China's CCL raw material supply and demand chain has undergone important changes; at the same time, 5G has made high-frequency and high-speed circuit copper clad laminates, high-level HDI and IC packaging substrate substrate materials in terms of technology, performance, and variety. There has been a great evolution. With the two major changes, research on the supply chain pattern of electronic copper foils, special resins, and special glass fiber cloth used in new and high-end substrate materials and the new performance requirements of the materials have become urgent tasks.
The global low-profile copper foil production and sales volume (ie market size) is estimated to increase by 49.8% in 2019, reaching 53,000 tons. It is estimated to account for 7.6% of the total global electrolytic copper foil. Among the global high-frequency and high-speed electrolytic copper foil production and sales in 2019, the ratio of RTF to VLP+HVLP production and sales is about 77:23. However, the proportion of VLP+HVLP will increase in the next few years.
In 2019, domestic and foreign-funded copper foil enterprises in mainland China produced a total of 7,580 tons of low-profile copper foil, of which domestic-funded enterprises accounted for 51.2% (3880 tons). The production and sales of low-profile electrolytic copper foil by domestic enterprises accounted for 2.7% of the total output of electronic circuit copper foil by domestic enterprises (144,000 tons). In 2019, domestic domestic enterprises achieved new breakthroughs in mass production of VLP+HVLP varieties, but the production and sales of such low-profile copper foils are very small, accounting for only 2.3% of the total global production and sales of such electrolytic copper foils.
For high-frequency and high-speed circuit copper clad laminates above Low Loss (substrate Df≤0.008), there are two mainstream resin composition process routes: one is a process route composed of a thermoplastic resin system represented by PTFE; the other is a carbon Hydrogen resin or modified polyphenylene ether resin as the representative thermosetting resin system constitutes the process route.
In the second process route formed by the thermosetting resin system, currently it is based on "PPO as the main body + crosslinking agent (crosslinking agent can be bismarimide resin, triallyl triisocyanate (TAIC), Hydrocarbon resin, etc.)” accounted for the mainstream route. At the same time, the resin composition design technology for copper clad laminates for high-frequency and high-speed circuits has continued to advance in recent years and has become more diversified. The process route with modified maleimide (bi- and multifunctional type) as the main resin appeared; the process with special epoxy resin (dicyclopentadiene type, diphenyl ether type, etc.) + benzoxazine resin Lines and other components of Very Low Loss grades, and copper-clad laminates for high-frequency and high-speed circuit substrates below the extremely low loss grade. The domestic production of PTFE liquid for copper clad laminates is estimated to account for more than 60% of the global total.
Modified polyphenylene ether resin (PPO/PPE) is used as the main resin substrate material, which currently plays an irreplaceable role in the very low loss application field corresponding to 5G communication equipment. Most of its end products are servers for base station facilities. The in-depth development of 5G communications has rapidly expanded the demand for PPO/PPE. China Guangdong Tongyu has been mass-produced, Shandong Shengquan and Dongcai Technology have entered the customer trial and evaluation stage.
In the development of high-frequency and high-speed copper clad laminates, hydrocarbon resins have achieved rapid development in the substrate material industry in terms of variety, technology, and application breadth and scale. Hydrocarbon resin, maleimide (long chain), etc. are also used in the production of resin films used in high-end HDI boards, package carrier boards, and module substrates made by semi-additive processes. China still has shortcomings to catch up in the innovative development, mass production and application of hydrocarbon resins.
It should be noted that the global flexible substrate materials and the resin films for PCBs that have emerged in recent years have undergone major changes in resin materials. Domestic resin companies supporting the copper clad laminate industry should adapt to the new needs of these two types of substrate materials. In LCP crystal polymer, MPI (modified polyimide) resin, new TPI resin, modified bismaleimide Amine resin (modified BMI), special epoxy resin (phenoxy resin, etc.).
Global and China's copper clad laminate industry currently has two hot demands for fiberglass cloth as a reinforcing material. One is ultra-thin or ultra-thin glass fiber cloth; the second is low-dielectric glass fiber electronic cloth. These two popular varieties, the main market is high-frequency and high-speed copper clad laminates.
Performance requirements for ultra-thin or ultra-thin glass fiber cloth
The use of ultra-thin glass fiber cloth has become a trend: now electronic cloths like 1067# (0.035mm), 106# (0.033mm), and 1037# (0.027mm) have been widely used. In the manufacturing of copper clad laminates and prepreg materials used for packaging substrates, high-end HDI boards, optical module substrates, high-speed circuit substrates, and RF-microwave circuit substrates, there is an urgent need to choose ultra-thin fiberglass cloth. The main models of ultra-thin fiberglass cloth are 1027# (0.019mm); 1017# (0.014mm).
Substrate materials using extremely thin glass fiber cloth are currently used in two major areas: one is the new optical module substrate for 5G communication (in the category of high-speed circuit substrates), and the other is the thin SiP packaging substrate. Ultra-thin fiberglass cloth and ultra-thin fiberglass cloth not only have to bear the important task of "thinning" the irreplaceable substrate, but also because of its "thin" and "density" characteristics, it can reduce signal transmission loss (reduce wire Clock skew, wire impedance surface distribution accuracy, increase the resin content of PP, etc.), improve elastic modulus (to achieve dimensional stability, reduce warpage in sheet thermal processing, etc.), improve substrate reliability, etc. Performance is effective.